DocumentCode
3518628
Title
Drift-Tolerant Multilevel Phase-Change Memory
Author
Papandreou, N. ; Pozidis, H. ; Mittelholzer, T. ; Close, G.F. ; Breitwisch, M. ; Lam, C. ; Eleftheriou, E.
Author_Institution
IBM Res. - Zurich, Ruschlikon, Switzerland
fYear
2011
fDate
22-25 May 2011
Firstpage
1
Lastpage
4
Abstract
Multilevel-cell (MLC) storage is a typical way for achieving increased capacity and thus lower cost-per-bit in memory technologies. In phase-change memory (PCM), however, MLC storage is seriously hampered by the phenomenon of resistance drift. Reference cells may be used to offer some relief, however their effectiveness is limited due to the stochastic nature of drift. In this paper, an alternative way to cope with drift in PCM is introduced, based on modulation coding. The new drift tolerant coding technique encodes information in the relative order of resistance levels in a codeword. Experimental results from a 90-nm PCM prototype chip demonstrate the effectiveness of the proposed method in offering high resilience to drift. Most notably, 4 levels/cell storage with raw bit-error-rates in the order of 10-5 is achieved in a 200 kcell array and maintained for over 30 days after programming at room temperature.
Keywords
error statistics; modulation coding; phase change memories; MLC storage; bit-error-rates; drift tolerant coding technique; drift-tolerant multilevel phase-change memory; modulation coding; multilevel-cell storage; reference cells; resistance drift; room temperature; size 90 nm; temperature 293 K to 298 K; Arrays; Encoding; Phase change materials; Phase change memory; Programming; Reliability; Resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2011 3rd IEEE International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4577-0225-9
Electronic_ISBN
978-1-4577-0224-2
Type
conf
DOI
10.1109/IMW.2011.5873231
Filename
5873231
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