• DocumentCode
    3518639
  • Title

    Prediction model for wire bonding process through adaptive neuro-fuzzy inference system

  • Author

    Gao, Jian ; Liu, Changhong ; Chen, Xin ; Zheng, Detao ; Li, Ketian

  • Author_Institution
    Fac. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    913
  • Lastpage
    917
  • Abstract
    In the wire bonding process, different combinations of parameter values will directly affect wire bonding quality. The optimal combination of these parameter values is very important to ensure the overall process quality response. Therefore, it is necessary to investigate the effects and interactive relationship of the bonding parameters on the bonding quality. This paper chooses the response factors of shear strength and Squashed Ball Diameter (SBD) for the bonding quality evaluation. Through the design of experiments (DOE) method, 60 sets of experimental samples of the ball bond, varying 9 process parameters are manufactured and tested. The effect of the variation of these parameters on the shear force and SBD are analyzed and 6 out of 9 parameters are determined to be controlling factors in the prediction model. Considering the difficulty in analyzing the nonlinear and interactive relationships between the parameters and bonding quality, this paper proposes a process modeling approach based on an adaptive Neuro-Fuzzy Inference System. For the construction of the prediction model 50 sets of samples, where the 6 process control parameters are varied are prepared. These are used for the training of the process prediction model and a further 15 sets of samples are used for model validation. An error analysis is then performed to evaluate the model created. Based on the process prediction model, the characteristics of the bonding parameters affecting bonding quality are obtained, that can then be used for the optimization of wire bonding process.
  • Keywords
    adaptive systems; design for manufacture; design of experiments; electronic engineering computing; fuzzy neural nets; fuzzy reasoning; lead bonding; production engineering computing; shear strength; statistical analysis; adaptive neuro-fuzzy inference system; analysis of variance; bonding parameters; bonding quality evaluation; design of experiments; overall process quality response; process control parameters; process prediction model; shear strength; squashed ball diameter; wire bonding process modeling approach; wire bonding process optimization; Adaptive systems; Bonding processes; Error analysis; Force control; Manufacturing processes; Predictive models; Process control; Testing; US Department of Energy; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270555
  • Filename
    5270555