DocumentCode :
3518742
Title :
Electro-mechanical evaluation of Ag trace patterns by ink-jet printing
Author :
Quintero, J.A. ; Mancosu, R.D. ; de Oliveira, A.W.C. ; Rolim, D.C. ; da Silva, O.C. ; Silva, Joao M.
Author_Institution :
NETO, Nokia Inst. of Technol. INdT, Manaus, Brazil
fYear :
2009
fDate :
9-11 Dec. 2009
Firstpage :
1000
Lastpage :
1005
Abstract :
Ink-jet printing is a novel method to promote electrical circuit by printing metal nanoparticles onto flexible substrates. This novel method allows to develop sensor that can be used to measure deformation, and also to measure the life cycle of a material. The conductive ink printed directly onto flexible surface allows to evaluate the behaviour of the substrate material under mechanical solicitation. The present work aims to evaluate electro-mechanically the conductive trace obtained by silver nano-particles. The trace consists of a line of 25 mm equivalent to one grid of a printed strain gauge. The amount of layer and the width of the trace was evaluated in order to selected the best set-up, in which is the sample that have low level of roughness and satisfactory reproducibility of the electrical resistance. Cyclic bending fatigue test were carried out on selected samples with two different displacement applied. Ag printed trace submitted to 4 of mm displacement presented life cycle 50% less than displacement of 2 mm.
Keywords :
electronic products; flexible electronics; ink jet printing; nanoparticles; cyclic bending fatigue test; electro-mechanical evaluation; flexible substrates; ink-jet printing; metal nanoparticles; trace patterns; Capacitive sensors; Conducting materials; Electric resistance; Fatigue; Flexible printed circuits; Ink jet printing; Mechanical sensors; Nanoparticles; Reproducibility of results; Silver;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
Type :
conf
DOI :
10.1109/EPTC.2009.5416397
Filename :
5416397
Link To Document :
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