• DocumentCode
    3518757
  • Title

    Optimization of microfluidic flow sensors for different flow ranges by FEM simulation

  • Author

    Ender, Ferenc ; Sántha, Hunor ; Székely, Vladimír

  • Author_Institution
    Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
  • fYear
    2010
  • fDate
    12-16 May 2010
  • Firstpage
    308
  • Lastpage
    313
  • Abstract
    Finite element simulation and post-processing results of calorimetric type microfluidic mass flow sensors are presented. The output characteristics of a calorimetric flow sensor are functions of the geometrical position of the temperature sensor elements. A given flow sensor (with a given technology on a given substrate) can be optimized for different flow ranges by determining the position of the temperature sensor elements. The simplified mathematical model of the steady-state thermal profile along the microfluidic channel is presented. It is also shown how the output characteristics depend on the position of the temperature sensors and the ratio of the convective and conductive heat transfer. The optimal parameters of a silicon substrate based microfluidic flow sensor for low and for high flow ranges were calculated by FEM simulation. Based on the simulation results the silicon substrate based microfluidic flow sensor could be optimized for different flow ranges.
  • Keywords
    calorimetry; convection; finite element analysis; flow sensors; heat conduction; microchannel flow; temperature sensors; FEM simulation; calorimetric type microfluidic mass flow sensor; finite element simulation; heat transfer; microfluidic channel; steady-state thermal profile; temperature sensor element; Finite element methods; Fluids; Heat transfer; Heating; Sensor phenomena and characterization; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4244-7849-1
  • Electronic_ISBN
    978-1-4244-7850-7
  • Type

    conf

  • DOI
    10.1109/ISSE.2010.5547309
  • Filename
    5547309