A study on the thermal deformation and the mechanical properties due to curing process of the encapsulation resin

Since the flexural rigidity of thin semiconductor package become much lower than normal components, the warpage of the component become a much more important issue to evaluate the reliability. In this study the author´s proposal a new practical shrinkage method to measure the real time curing deformation and the elastic modulus resin during the whole curing process. the thermal deformation of the resin under curing was measured by using the optical digital image correlation method. Next, to examine the mechanical properties of the resin, the liquid resin was poured into an aluminum frame with thin sole, and the bending rigid of the aluminum frame was measured by the three points bending test every minutes at the curing temperature of the resin. Based upon the experimented result, the effect of curing shrinkage on the warpage of a CSP package was confirmed, and it was found that the shrinkage properties can affect not only the warpage of the component about also the thermal cyclic fatigue life.