• DocumentCode
    3518896
  • Title

    A Consolidated Approach to Minimize Semiconductor Production Loss Due to Unscheduled ATE Downtime

  • Author

    Jin, Tongdan ; Belkhouche, Fethi ; Sung, Chen-Han

  • Author_Institution
    Texas A&M Int. Univ., Laredo
  • fYear
    2007
  • fDate
    22-25 Sept. 2007
  • Firstpage
    188
  • Lastpage
    193
  • Abstract
    A production-loss based maintenance plan is proposed to minimize the cost due to unscheduled ATE (automatic test equipment) downtime in the back-end process of semiconductor manufacturing. This paper suggests two methods, active redundancy and cold standby redundancy, to expedite the ATE system repair time for returning the system back to production. This strategy is different from other reliability improvement methods such as corrective actions and preventive maintenance. By reducing the repair time, the system upper time actually increases and hence the production loss is minimized. The optimization is formulated to minimize the production loss considering the system depreciations, lost sales and idle labor when they are subject to maintenance budget and volume constraint. To solve this optimization problem, genetic algorithm is used to find the near-optimal solution. The illustrative example demonstrates that using redundant modules is a very effective way to minimize the semiconductor production loss due to unscheduled system downtime.
  • Keywords
    automatic test equipment; genetic algorithms; preventive maintenance; reliability; semiconductor device manufacture; active redundancy; automatic test equipment; cold standby redundancy; genetic algorithm; maintenance plan; optimization problem; preventive maintenance; reliability improvement method; repair time; semiconductor manufacturing; semiconductor production loss; unscheduled ATE downtime; Automatic test equipment; Constraint optimization; Costs; Manufacturing automation; Manufacturing processes; Marketing and sales; Preventive maintenance; Production systems; Redundancy; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Science and Engineering, 2007. CASE 2007. IEEE International Conference on
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    978-1-4244-1154-2
  • Electronic_ISBN
    978-1-4244-1154-2
  • Type

    conf

  • DOI
    10.1109/COASE.2007.4341712
  • Filename
    4341712