Inspection of miniaturised interconnections in IC packages with nanofocus X-ray tubes and nanoCT

Author

He, Zhenhui ; Wen, Quan ; Huang, Xiaojie

Author_Institution

GE Sensing & Inspection GmbH, Wunstorf, Germany

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

996

Lastpage

1001

Abstract

Nanofocus tube technology and high resolution CT are the future inspection tools for IC packages. The elementary principles and techniques of latest 2D and 3D nanofocus techniques are briefly outlined and typical results of highest resolution failure analysis including bond wire defects, copper bond wire inspection, flip chip solder interconnection and microvia inspection are presented.

Keywords

X-ray tubes; computerised tomography; failure analysis; flaw detection; flip-chip devices; inspection; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; lead bonding; solders; 2D nanofocus techniques; 3D nanofocus techniques; IC packages; bond wire defects; copper bond wire inspection; failure analysis; flip chip solder interconnection; high-resolution nanoCT; microvia inspection; miniaturised interconnection; nanofocus X-ray tube technology; Bonding; Computed tomography; Copper; Failure analysis; Flip chip; Image resolution; Inspection; Integrated circuit packaging; Wire; X-ray imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270572

Filename

5270572