Title :
Inspection of miniaturised interconnections in IC packages with nanofocus X-ray tubes and nanoCT
Author :
He, Zhenhui ; Wen, Quan ; Huang, Xiaojie
Author_Institution :
GE Sensing & Inspection GmbH, Wunstorf, Germany
Abstract :
Nanofocus tube technology and high resolution CT are the future inspection tools for IC packages. The elementary principles and techniques of latest 2D and 3D nanofocus techniques are briefly outlined and typical results of highest resolution failure analysis including bond wire defects, copper bond wire inspection, flip chip solder interconnection and microvia inspection are presented.
Keywords :
X-ray tubes; computerised tomography; failure analysis; flaw detection; flip-chip devices; inspection; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; lead bonding; solders; 2D nanofocus techniques; 3D nanofocus techniques; IC packages; bond wire defects; copper bond wire inspection; failure analysis; flip chip solder interconnection; high-resolution nanoCT; microvia inspection; miniaturised interconnection; nanofocus X-ray tube technology; Bonding; Computed tomography; Copper; Failure analysis; Flip chip; Image resolution; Inspection; Integrated circuit packaging; Wire; X-ray imaging;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270572
