Title :
Effects of thermal aging on the electrical resistance of Sn-3.5Ag micro SOH solder joints
Author :
Peng, Jin ; Wu, Fengshun ; Liu, Hui ; Zhou, Longzao ; Pan, Qilin
Author_Institution :
Wuhan Nat. Lab. for Optoelectron., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
The relationship among the electrical resistance, the thickness of the IMC layer and the aging timer of the micro SOH solder joints is investigated in present paper. It´s found that the composition of compositions of the intermetallic compounds are Cu3Sn near the Cu side and Cu6Sn5 near the solder side; With the increasing of aging time, the thickness of the Cu3Sn increased while the thickness of the Cu6Sn5 decreased. The total thickness of IMCs (Cu6Sn5 and Cu3Sn) increased as the aging time increased, while the resistance of the micro SOH solder joints increased at first and then decreased. The resistance of solder joints increased at first and then decreased as the total thickness of IMCs (Cu6Sn5 and Cu3Sn) increased.
Keywords :
ageing; copper alloys; electric resistance; electronics packaging; metallisation; silver alloys; soldering; thermal stresses; tin alloys; Cu3Sn; Cu6Sn5; Sn-Ag; electrical resistance; intermetallic compound layer; micro SOH solder joints; stand-off height; thermal aging; Aging; Bars; Electric resistance; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Materials science and technology; Packaging; Soldering; Thermal resistance;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270577
