Effect of Zn addition on microstructure of Sn-Bi joint

Author

Zhu, Q.S. ; Song, H.Y. ; Liu, H.Y. ; Wang, Z.G. ; Shang, J.K.

Author_Institution

Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

1043

Lastpage

1046

Abstract

Zn was added into Sn-Bi solder to investigate the effect of Zn on the microstructure of the alloy. Zn addition was found to refine and redistribute the Bi-rich phase. With Zn addition, a different intermetallic compound, Cu₅Zn₈ was formed at the Sn-Bi-Zn/Cu interface upon reflow. After aging, the Bi segregation was not observed at the Sn-Bi-Zn/Cu interface while a continuous Bi segregation layer appeared in the Sn-Bi/Cu interface. The Zn addition into the solder freed Sn near the interface from interfacial reaction, which suppressed the occurrence of Bi segregation layer.

Keywords

ageing; alloying additions; bismuth alloys; copper alloys; segregation; solders; tin alloys; zinc compounds; SnBiZn-Cu; aging; intermetallic compound; joint; microstructure; segregation; zinc addition; Aging; Bismuth; Electronic packaging thermal management; Intermetallic; Microstructure; Scanning electron microscopy; Soldering; Temperature sensors; Tin; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270582

Filename

5270582