Title :
Inductors from wafer-level package process for high performance RF applications
Author :
Guruprasad, Badakere ; Lin, Yaojian ; Chelvam, M. Pandi ; Yoon, Seung Wook ; Liu, Kai ; Frye, Robert C.
Author_Institution :
STATS ChipPAC, Ltd., Singapore, Singapore
Abstract :
In this paper, inductors embedded in a mold material are characterized. Due to the low-loss property of the mold material, plated Cu inductors show high quality-factor (Q) performance. This performance is also better than those of similar inductors implemented from our IPD process. The mold material is not only used as a supporting substrate, but also served as package substrate, which allows the high-Q inductors to be implemented with other RF chips (CMOS PA for example) in one single package. Design methodology for such packaging environment is discussed.
Keywords :
Q-factor; inductors; wafer level packaging; high performance RF applications; high-Q inductors; mold material; package substrate; quality-factor; wafer-level package; Inductors; Packaging; Radio frequency; Wafer scale integration;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416417
