Influencing factors and solutions for ball short during wire bonding

Author

Meng, Zhong ; Feng, Yusheng ; Lee, Sunggug

Author_Institution

Samsung Electron. (Suzhou) Semicond. Co., Ltd., Suzhou, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

1075

Lastpage

1078

Abstract

During cold season (from November to April), ball short failure caused by ball deformation often occurred and pad corrosion during PCT is also detected simultaneously, so it is urgent to find root cause and assure wire bond quality. The paper reveals that ball deformation and pad corrosion are mainly caused by S and Cl in atmosphere composition. The solution of adding chemical filter is presented and a mini-environment is setup to confirm efficiency, finally ball deformation and PCT failures are eliminated.

Keywords

chlorine; corrosion; deformation; failure analysis; lead bonding; sulphur; Cl; PCT failure elimination; S; airborne acidity molecule; atmosphere composition; ball deformation; ball short failure; chemical filter; pad corrosion; pressure cooker test; wire bonding quality; Bonding processes; Contamination; Corrosion; Electronic equipment testing; Electronics packaging; Gas detectors; Humidity; Materials testing; Scanning electron microscopy; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270588

Filename

5270588