Application of silver nanoparticles to improve wettability of SnAgCu solder paste

Author

Koscielski, Marek ; Bukat, Krystyna ; Jakubowska, Malgorzata ; Mlozniak, Anna

Author_Institution

Tele & Radio Res. Inst. (ITR), Warsaw, Poland

fYear

2010

fDate

12-16 May 2010

Firstpage

473

Lastpage

477

Abstract

Due to European regulations (RoHS) lead-free solder pastes have been commonly used in electronics assembly for printed wiring board (PWB) assembly in surface mount technology applications. The most popular are pastes with SnAgCu (SAC) alloy family. It is well known that some of material properties can be changed by addition of nanoparticles. Our research objective is trying to modify the lead-free solder paste wettability by silver nanoparticles. The nanoparticles of silver with different grain sizes were added to the own developed SAC solder paste. We found improvement of the wetting results of investigated “nano solder pastes” on copper substrate depending on temperatures (220, 230, 240, 250°C) as well as on nano silver grain size. Using SEM microscope and EDS spectroscopy we found that silver nanoparticles provoke differences in the microstructure of solder joints as well as create the IMC rod and scallop form layers with different thickness after reflow process.

Keywords

X-ray chemical analysis; copper alloys; grain size; nanoparticles; reflow soldering; scanning electron microscopy; silver; silver alloys; solders; tin alloys; wetting; EDS spectroscopy; IMC rod; SAC alloy family; SEM microscope; SnAgCu-Ag; copper substrate; electronics assembly; lead-free solder pastes; material properties; nanoparticle addition; nanosilver grain size; nanosolder pastes; printed wiring board assembly; reflow process; silver nanoparticles; solder joint microstructure; surface mount technology applications; temperature 220 degC; temperature 230 degC; temperature 240 degC; temperature 250 degC; wettability; wetting; Copper; Lead; Microstructure; Nanoparticles; Silver; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2010 33rd International Spring Seminar on

Conference_Location

Warsaw

Print_ISBN

978-1-4244-7849-1

Electronic_ISBN

978-1-4244-7850-7

Type

conf

DOI

10.1109/ISSE.2010.5547345

Filename

5547345