Title :
Application of silver nanoparticles to improve wettability of SnAgCu solder paste
Author :
Koscielski, Marek ; Bukat, Krystyna ; Jakubowska, Malgorzata ; Mlozniak, Anna
Author_Institution :
Tele & Radio Res. Inst. (ITR), Warsaw, Poland
Abstract :
Due to European regulations (RoHS) lead-free solder pastes have been commonly used in electronics assembly for printed wiring board (PWB) assembly in surface mount technology applications. The most popular are pastes with SnAgCu (SAC) alloy family. It is well known that some of material properties can be changed by addition of nanoparticles. Our research objective is trying to modify the lead-free solder paste wettability by silver nanoparticles. The nanoparticles of silver with different grain sizes were added to the own developed SAC solder paste. We found improvement of the wetting results of investigated “nano solder pastes” on copper substrate depending on temperatures (220, 230, 240, 250°C) as well as on nano silver grain size. Using SEM microscope and EDS spectroscopy we found that silver nanoparticles provoke differences in the microstructure of solder joints as well as create the IMC rod and scallop form layers with different thickness after reflow process.
Keywords :
X-ray chemical analysis; copper alloys; grain size; nanoparticles; reflow soldering; scanning electron microscopy; silver; silver alloys; solders; tin alloys; wetting; EDS spectroscopy; IMC rod; SAC alloy family; SEM microscope; SnAgCu-Ag; copper substrate; electronics assembly; lead-free solder pastes; material properties; nanoparticle addition; nanosilver grain size; nanosolder pastes; printed wiring board assembly; reflow process; silver nanoparticles; solder joint microstructure; surface mount technology applications; temperature 220 degC; temperature 230 degC; temperature 240 degC; temperature 250 degC; wettability; wetting; Copper; Lead; Microstructure; Nanoparticles; Silver; Soldering;
Conference_Titel :
Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7849-1
Electronic_ISBN :
978-1-4244-7850-7
DOI :
10.1109/ISSE.2010.5547345
