Title :
Properties of conductive microstructures containing nano sized silver particles
Author :
Felba, Jan ; Nitsch, Karol ; Piasecki, Tomasz ; Tesarski, Sebastian ; Moscicki, Andrzej ; Kinart, Andrzej ; Bonfert, Detlef ; Bock, Karlheinz
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
Abstract :
The properties of the structures made by ink-jet printing with the use of the ink containing nano silver sized particles are presented. After structures printing on substrate, to obtain good electrical conductivity, sintering process is necessary. It is shown, that thermal process influences strongly the resistance, and after the process the resistivity of printed structures can be only a little bit higher than the value of the bulk material. Also different electrical test proved similarity between printed and bulk silver. It was stated that the adding some polymer materials for mechanical parameters improving of printed materials up to 1.5% of total mass of the ink do not influence significantly electrical parameters of the printed layers.
Keywords :
electrical conductivity; electronics packaging; ink; ink jet printing; nanofabrication; nanoparticles; polymers; silver; Ag; conductive microstructures; electrical conductivity; ink-jet printing; nanosized silver particles; polymer materials; printed materials; resistivity; sintering; thermal process; Conducting materials; Conductivity; Electric resistance; Electronic equipment testing; Ink; Microstructure; Printing; Protection; Silver; Temperature distribution;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416421