Title :
Plastic circuit reliability and design for recycling
Author :
Thiel, David V. ; Neeli, Madhusudanrao ; Raj, Sundra
Author_Institution :
Centre for Wireless Monitoring & Applic., Griffith Univ., Nathan, QLD, Australia
Abstract :
Electronics is a major contributor to solid waste streams around the world. The manufacturing and the recycling processes currently used in the electronics industry are energy intensive and are accompanied by noxious gaseous and liquid waste. Circuits in Plastic (CiP) is a new technology designed to address issues. Circuit components are placed in a plastic substrate, conductive tracks are screen printed and the completed completed by thermally binding a cover sheet of the same material. The circuits are disassembled by mechanical means. While the process requires much less energy and produces minimal waste, the process must be reliable. Mechanical experiments and thermal modeling have supported the viability of the technology. Microcontroller circuits manufactured in this way have remained functional over 4 years and a water proof and mechanically reliable.
Keywords :
microcontrollers; network synthesis; recycling; reliability; circuit components; conductive tracks; mechanical experiments; microcontroller circuits; plastic circuit design; plastic circuit reliability; plastic substrate; recycling processes; solid waste streams; thermal modeling; water proof; Circuits; Conducting materials; Electronics industry; Manufacturing processes; Microcontrollers; Plastics; Recycling; Sheet materials; Solids; Thermal conductivity;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416425