Title :
Board level reliability assessments of thru-mold via package on package (TMV™ PoP)
Author :
Tae-Kyung Hwang ; Dong-Joo Park ; Jin-Seong Kim ; Jae-Dong Kim ; Choon-Heung Lee
Author_Institution :
Amkor Technol. Korea, Inc., Seoul, South Korea
Abstract :
In recent years, package-on-package (PoP) has been adopted as major application package platform in 3D integration of logic and memory devices. However, as electronic technology developed, higher technology requirements are requested in packaging. Amkor Technology, Inc introduced the next generation PoP solution to meet the next generation technology requirements in 2008 by the using of TMVtrade technology which incorporates a laser ablation process that is conducive to current matrix-molded semiconductor assembly techniques. The next generation PoP platform named as TMVtrade PoP has been qualified in all package level qualification tests. Also in board level reliability tests, BLR TC & drop performances are similar or better than those of the conventional PoP.
Keywords :
integrated circuit packaging; integrated circuit reliability; logic devices; moulding; 3D integration; Amkor Technology, Inc; BLR TC & drop performances; TMV PoP; board level reliability; electronic technology; logic devices; matrix-molded semiconductor assembly; memory devices; package on package; thru-mold via; Bonding; Chip scale packaging; Electronics packaging; Laser ablation; Logic devices; Memory architecture; Semiconductor device packaging; Signal processing; Stacking; Wire;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270597
