DocumentCode :
3519380
Title :
A new piezoresistive high pressure sensor utilizing combination of three-axis normal stress components
Author :
Toriyama, Toshipki ; Sawa, Kazuya ; Tanimoto, Yasutada ; Sugiyama, Susumu
Author_Institution :
Fac. of Sci. & Eng., Ritsumeikan Univ., Shiga, Japan
fYear :
1999
fDate :
1999
Firstpage :
215
Lastpage :
220
Abstract :
A piezoresistive high pressure sensor utilizing a combination of three-axis normal stress components has been developed. Firstly, the principle, FEM analysis, fabrication and characteristics of a newly developed piezoresistive force sensor are briefly summarized. Secondly, the force sensor is adopted as the sensing unit of a high pressure sensor. The pressure sensor is composed of an embedded force sensor unit, a metal diaphragm and a metal case. Pressure is transmitted into force which is applied to piezoresistors on a sensor chip through a force transmission rod. Stresses in piezoresistors depend on the diameter, height and Young´s modulus of the rod, and the diaphragm thickness of the sensor chip. In order to obtain large resistance changes in piezoresistors, the optimum combination of these parameters was investigated. A prototype pressure sensor having an SUS630 stainless steel diaphragm of 10 mm-diameter and 1 mm-thickness was fabricated. An output voltage of more than 50 mV/5 V at 150 MPa and a sensitivity temperature characteristic of 0.11% F.S/°C in the range from room temperature to 150°C were realized
Keywords :
diaphragms; electric sensing devices; finite element analysis; high-pressure techniques; piezoresistive devices; pressure sensors; stress analysis; 1 mm; 10 mm; 150 MPa; 20 to 150 C; FEM analysis; diaphragm thickness; embedded force sensor unit; fabrication; full bridge circuit; large resistance changes; metal case; metal diaphragm; piezoresistive force sensor; piezoresistive high pressure sensor; sensitivity temperature characteristic; stress analysis; three-axis normal stress components; Fabrication; Force sensors; Piezoresistance; Piezoresistive devices; Prototypes; Sensor phenomena and characterization; Steel; Stress; Temperature distribution; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micromechatronics and Human Science, 1999. MHS '99. Proceedings of 1999 International Symposium on
Conference_Location :
Nagoya
Print_ISBN :
0-7803-5790-6
Type :
conf
DOI :
10.1109/MHS.1999.820008
Filename :
820008
Link To Document :
بازگشت