DocumentCode :
3519410
Title :
Technical sessions
fYear :
2009
fDate :
9-11 Dec. 2009
Firstpage :
27
Lastpage :
48
Abstract :
Provides a schedule of conference events and a listing of which papers were presented in each session.
Keywords :
Bonding forces; Copper; Environmentally friendly manufacturing techniques; Flip chip; Indium; Lead compounds; Packaging; Semiconductor device reliability; Signal design; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
Type :
conf
DOI :
10.1109/EPTC.2009.5416430
Filename :
5416430
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3519410
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