Abstract :
The following topics are dealt with: copper wirebonding; flip chip interconnection; lead free solders; signal integrity; power integrity; thermal modelling; thermal characterization; manufacturing process; wafer level packaging; structural integrity; substrates; silicon technology; solder joint reliability; molding; encapsulation; electromigration; through silicon vias; drop impact reliability; die attach; light emitting diodes and optoelectronic packaging.
Keywords :
copper; electromigration; encapsulation; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; lead bonding; light emitting diodes; moulding; silicon; solders; substrates; three-dimensional integrated circuits; wafer level packaging; Cu; Si; copper wirebonding; die attach; drop impact reliability; electromigration; encapsulation; flip chip interconnection; lead free solders; light emitting diodes; manufacturing process; molding; optoelectronic packaging; power integrity; signal integrity; silicon technology; solder joint reliability; structural integrity; substrates; thermal characterization; thermal modelling; through silicon vias; wafer level packaging;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416432
