Study of isothermal bending fatigue test

TC test is very important for solder joint reliability, but the test time for TC test is very long, normally it cost about 2 months. In order to shorten TC test time, many researchers study the new test method to replace traditional TC test, such as bending fatigue test. However, there´s still some limit for this field study. Considering the actual user condition, the final product not only experience mechanical loading, but also thermal loading. Therefore, isothermal bending test (-25degC, 25degC, 75degC, 125degC) were studied to research the relationship of lifetime and failure mechanism between TC test and bending fatigue test. ANSYS was used to simulate isothermal bending fatigue test and also compare with traditional TC test.