Title :
XPS study on epoxy/Ni interface
Author :
Liu, Li ; Xv, Wenting
Author_Institution :
Dept. of Polymer Sci., Shanghai Univ., Shanghai, China
Abstract :
The interface between epoxy molding compound (EMC) and nickel has been investigated by using X-ray photoelectron spectroscopy (XPS). The change of binding energy of main element indicated that there was interaction between metallic and non-metallic element and new bond might exist in the interface.
Keywords :
X-ray photoelectron spectra; binding energy; interface structure; nickel; polymers; surface chemistry; Ni; X-ray photoelectron spectroscopy; XPS; binding energy; chemical reaction; epoxy molding compound; epoxy-nickel interface; Adhesives; Bonding; Chemicals; Electromagnetic compatibility; Epoxy resins; Materials science and technology; Nickel; Nitrogen; Polymers; Testing;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270603
