DocumentCode
3519500
Title
XPS study on epoxy/Ni interface
Author
Liu, Li ; Xv, Wenting
Author_Institution
Dept. of Polymer Sci., Shanghai Univ., Shanghai, China
fYear
2009
fDate
10-13 Aug. 2009
Firstpage
1264
Lastpage
1265
Abstract
The interface between epoxy molding compound (EMC) and nickel has been investigated by using X-ray photoelectron spectroscopy (XPS). The change of binding energy of main element indicated that there was interaction between metallic and non-metallic element and new bond might exist in the interface.
Keywords
X-ray photoelectron spectra; binding energy; interface structure; nickel; polymers; surface chemistry; Ni; X-ray photoelectron spectroscopy; XPS; binding energy; chemical reaction; epoxy molding compound; epoxy-nickel interface; Adhesives; Bonding; Chemicals; Electromagnetic compatibility; Epoxy resins; Materials science and technology; Nickel; Nitrogen; Polymers; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4658-2
Electronic_ISBN
978-1-4244-4659-9
Type
conf
DOI
10.1109/ICEPT.2009.5270603
Filename
5270603
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