DocumentCode
3519590
Title
A smart approach for process variation correlation modeling
Author
Lin, Chung-Kai ; Hsiao, Cheng ; Chan, Wei-Min ; Jeng, Min-Chie
Author_Institution
Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
fYear
2011
fDate
8-10 Sept. 2011
Firstpage
159
Lastpage
162
Abstract
Process variation has become a serious concern in nanometer technologies. Designs with competitive margins rely on well-characterized statistical models, which must predict the magnitude and scalability of variability accurately. In this paper, we propose a novel approach in creating the statistical models, which tracks the global variation correlation among logic and SRAM devices, hence more realistic. The simulation result is verified with TSMC N28 technology silicon. Two types of circuits, SRAM Vccmin calibration and a SRAM tracking circuit with logic, are discussed in this paper. Different simulation setups are applied on these two circuits to understand the impact of device correlation for the SRAM performance and design margin setting.
Keywords
SRAM chips; calibration; correlation theory; statistical analysis; SRAM Vccmin calibration; SRAM device; SRAM tracking circuit; TSMC N28 technology; nanometer technology; process variation correlation modeling; smart approach; statistical model; Calibration; Correlation; Integrated circuit modeling; Monte Carlo methods; Random access memory; Semiconductor process modeling; Silicon; Correlation; Global variation; Local variation; Monte Carlo; Process variation; SRAM Vccmin; Statistical model; Tracking circuit;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
Conference_Location
Osaka
ISSN
1946-1569
Print_ISBN
978-1-61284-419-0
Type
conf
DOI
10.1109/SISPAD.2011.6034966
Filename
6034966
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