Title :
Numerical simulation on variable width multi-channels heat sinks with non-uniform heat source
Author :
Wang, Xiaojing ; Zhang, Wen ; Liu, Hongjun ; Chen, Ling ; Li, Zongshuo
Author_Institution :
Shanghai Univ., Shanghai, China
Abstract :
The micro-channel heat sink (MCHS) is almost using a separate production of silicon or copper MCHS, which is indirectly on package dimensions. Using this package structure of the heat sink, the temperature of its central region is much higher than the surrounding region. It makes the surface of the hot load non-uniformly. At present, most of the studies have adopted the uniform thermal load, regardless of the way through trial or through the means of simulation. Traditional micro-channel has effects on treating the uniform thermal load, however, its structure needs to be further improved in order to reduce the hot concentrated caused by the non-uniformity. Few papers have done the research about the non-uniform heat source distributions. In this paper, the non-uniform heat source distributions are studied in the micro-channel heat sink (MCHS) cooler. The simulation model is established to analyze the temperature and pressure distributing of the MCHS with different channel width-dimensions. Water is chosen as the coolant for its superior hot properties and the velocity range is from 0.01 m/s to 10 m/s. With the simulation of the computation fluid dynamics software FLUENT, results show that the non-equal displacement of fins can effectively decrease the temperature rise under the same conditions cooling a non-uniform heat source.
Keywords :
computational fluid dynamics; cooling; copper; electronics packaging; heat sinks; microchannel flow; numerical analysis; silicon; temperature distribution; thermal management (packaging); computation fluid dynamics; coolant; copper MCHS; heat management; microchannel heat sink cooler; microchannel heat sink structure; nonuniform heat source distribution; numerical simulation; package dimension; pressure distribution; silicon MCHS; software FLUENT; superior hot properties; temperature distribution; Computational modeling; Copper; Heat sinks; Numerical simulation; Packaging; Production; Silicon; Surface treatment; Temperature; Thermal loading;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270609