• DocumentCode
    3519615
  • Title

    Numerical simulation on variable width multi-channels heat sinks with non-uniform heat source

  • Author

    Wang, Xiaojing ; Zhang, Wen ; Liu, Hongjun ; Chen, Ling ; Li, Zongshuo

  • Author_Institution
    Shanghai Univ., Shanghai, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    1155
  • Lastpage
    1158
  • Abstract
    The micro-channel heat sink (MCHS) is almost using a separate production of silicon or copper MCHS, which is indirectly on package dimensions. Using this package structure of the heat sink, the temperature of its central region is much higher than the surrounding region. It makes the surface of the hot load non-uniformly. At present, most of the studies have adopted the uniform thermal load, regardless of the way through trial or through the means of simulation. Traditional micro-channel has effects on treating the uniform thermal load, however, its structure needs to be further improved in order to reduce the hot concentrated caused by the non-uniformity. Few papers have done the research about the non-uniform heat source distributions. In this paper, the non-uniform heat source distributions are studied in the micro-channel heat sink (MCHS) cooler. The simulation model is established to analyze the temperature and pressure distributing of the MCHS with different channel width-dimensions. Water is chosen as the coolant for its superior hot properties and the velocity range is from 0.01 m/s to 10 m/s. With the simulation of the computation fluid dynamics software FLUENT, results show that the non-equal displacement of fins can effectively decrease the temperature rise under the same conditions cooling a non-uniform heat source.
  • Keywords
    computational fluid dynamics; cooling; copper; electronics packaging; heat sinks; microchannel flow; numerical analysis; silicon; temperature distribution; thermal management (packaging); computation fluid dynamics; coolant; copper MCHS; heat management; microchannel heat sink cooler; microchannel heat sink structure; nonuniform heat source distribution; numerical simulation; package dimension; pressure distribution; silicon MCHS; software FLUENT; superior hot properties; temperature distribution; Computational modeling; Copper; Heat sinks; Numerical simulation; Packaging; Production; Silicon; Surface treatment; Temperature; Thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270609
  • Filename
    5270609