DocumentCode :
3519885
Title :
Thermal-mechanical failure and life analysis on CBGA package used for great scale FPGA chip
Author :
Li, Wenchang ; Zhang, Xiaojun
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, UESTC, Chengdu, China
fYear :
2009
fDate :
10-13 Aug. 2009
Firstpage :
1216
Lastpage :
1219
Abstract :
CBGA (ceramic ball grid array) is one kind of advanced package for FPGA, which can fulfill the demands of high interconnect density, high thermal and electronic performance, high chip-assembling yields, high reliability. But in multiple loading environments, CBGA has the invalidation mode of solder joint thermal-mechanical failure, which will influence the long term reliability of FPGA circuits. But there is few research on the China native made CBGA package. In this paper research of finite element analysis and solder joint fatigue predictive equation have been made on some of CBGA packages, and some failure prediction and ATC test results have been given.
Keywords :
ball grid arrays; ceramic packaging; chip scale packaging; field programmable gate arrays; finite element analysis; integrated circuit modelling; integrated circuit reliability; life testing; solders; thermal stress cracking; ATC test; CBGA package; FPGA chip; ceramic ball grid array; circuit reliability; failure prediction; finite element analysis; life analysis; solder joint fatigue predictive equation; thermal fatigue; thermal-mechanical failure; Ceramics; Chip scale packaging; Electronic packaging thermal management; Electronics packaging; Failure analysis; Field programmable gate arrays; Finite element methods; Integrated circuit interconnections; Soldering; Thermal loading;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
Type :
conf
DOI :
10.1109/ICEPT.2009.5270622
Filename :
5270622
Link To Document :
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