Title :
Thermal performance of PCM-cooled mobile phone
Author :
Tan, F.L. ; Shen, W. ; Jony ; Fok, S.C.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
This paper presents the experimental study of using phase change material (PCM) in the cooling of the mobile phone. It investigates the thermal performance of transient charging and discharging of mobile phone in three different situations; making phone calls frequently, making long duration calls and making occasional calls. The results show that mobile phones are heated up fastest during the long duration usage. Experiments are also conducted to determine the effect of fins and effect of orientation of the mobile phone on its thermal performance.
Keywords :
cooling; mobile handsets; phase change materials; thermal management (packaging); frequently phone calls; long duration calls; mobile phone cooling; mobile phone transient charging thermal performance; mobile phone transient discharging thermal performance; occasional calls; phase change material; Cooling; Electronic packaging thermal management; Energy management; Heat sinks; Mobile handsets; Phase change materials; Space technology; Temperature; Thermal conductivity; Thermal management;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416470