DocumentCode :
3520063
Title :
Thermal performance of PCM-cooled mobile phone
Author :
Tan, F.L. ; Shen, W. ; Jony ; Fok, S.C.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear :
2009
fDate :
9-11 Dec. 2009
Firstpage :
640
Lastpage :
645
Abstract :
This paper presents the experimental study of using phase change material (PCM) in the cooling of the mobile phone. It investigates the thermal performance of transient charging and discharging of mobile phone in three different situations; making phone calls frequently, making long duration calls and making occasional calls. The results show that mobile phones are heated up fastest during the long duration usage. Experiments are also conducted to determine the effect of fins and effect of orientation of the mobile phone on its thermal performance.
Keywords :
cooling; mobile handsets; phase change materials; thermal management (packaging); frequently phone calls; long duration calls; mobile phone cooling; mobile phone transient charging thermal performance; mobile phone transient discharging thermal performance; occasional calls; phase change material; Cooling; Electronic packaging thermal management; Energy management; Heat sinks; Mobile handsets; Phase change materials; Space technology; Temperature; Thermal conductivity; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
Type :
conf
DOI :
10.1109/EPTC.2009.5416470
Filename :
5416470
Link To Document :
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