DocumentCode :
3520084
Title :
Performance analysis of a synthetic jet-microchannel hybrid heat sink for electronic cooling
Author :
Chandratilleke, T.T. ; Jagannatha, D. ; Narayanaswamy, R.
Author_Institution :
Dept. of Mech. Eng., Curtin Univ. of Technol., Perth, WA, Australia
fYear :
2009
fDate :
9-11 Dec. 2009
Firstpage :
630
Lastpage :
635
Abstract :
This paper proposes a novel concept for enhancing the heat removal potential in a microchannel-based heat sinks and presents a study of its thermal performance. This technique utilises a jet mechanism that injects into the heat sink´s flow passage a strong periodic fluid jet without any net mass outflow through the discharge orifice, hence termed ¿synthetic jet¿. The flow within this microchannel-synthetic jet hybrid heat sink is modelled as a 2-dimensional finite volume simulation with unsteady Reynolds-averaged Navier-Stokes equations while using the Shear-Stress-Transport (SST) k-¿ turbulence model to account for fluid turbulence. For a range of conditions, the characteristics of this periodically interrupted micro fluid flow are identified while evaluating its convective heat transfer rates. The results indicate that this pulsed jet micro-heat sink can deliver heat removal rates 4.3 times higher than an equivalent heat sink without jet mechanism. The thermal enhancement is first seen to grow gently and then rather rapidly beyond a certain flow condition to reach a steady value. The proposed strategy has the unique intrinsic ability to deliver unprecedented thermal performance in micro-heat sinks without additional fluid circuits or pressure drop. The technique has application potential in miniature electronic devices where intense localised cooling is desired over a base heat load.
Keywords :
Navier-Stokes equations; cooling; finite volume methods; heat sinks; jets; microchannel flow; turbulence; 2D finite volume simulation; Reynolds-averaged Navier-Stokes equations; electronic cooling; fluid jet; fluid turbulence; heat removal potential; heat transfer; micro-heat sinks; miniature electronic devices; performance analysis; shear-stress-transport k-¿ turbulence model; synthetic jet-microchannel hybrid heat sink; Circuits; Electronic packaging thermal management; Electronics cooling; Fluid flow; Heat engines; Heat sinks; Heat transfer; Orifices; Performance analysis; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
Type :
conf
DOI :
10.1109/EPTC.2009.5416472
Filename :
5416472
Link To Document :
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