Title :
Wetting behaviour of lead free solder on electroplated Ni and Ni-W alloy barrier film
Author :
Chew, C.S. ; Haseeb, A.S.M.A. ; Johan, M.R.
Author_Institution :
Dept. of Mech. Eng., Univ. of Malaya, Kuala Lumpur, Malaysia
Abstract :
In this work, electrodeposited Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt´s bath. Ni-W alloy films of about 1.5 to 2.5 mum were deposited from ammonia-citrate bath on copper substrate. Results show solder/Ni-W alloy system and solder/Ni system exhibited almost the same spreading rate and wetting angle. The wetting angle does not change significantly with tungsten content in the range of 11.3 to 18.0 at.%. Metallographic observation reveals that while intermetallic compound on Ni is continuous, that on Ni-W alloy film is discontinuous.
Keywords :
copper alloys; electroplated coatings; metallography; nickel alloys; silver alloys; soldering; solders; tin alloys; tungsten alloys; wetting; Cu; Ni; Ni-W; SAC387; Sn-Ag-Cu; Watt bath; ammonia-citrate bath; electroplated alloy barrier film; lead free solder; metallographic observation; size 1.5 mum to 2.5 mum; wetting behaviour; Copper alloys; Electronics industry; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Nickel alloys; Optical films; Soldering; Substrates; Tungsten;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270639
