Title :
Electrodeposition of Sn-Cu solder alloy for electronics interconnection
Author :
Qin, Yi ; Wassay, Abdul ; Liu, Changqing ; Wilcox, G.D. ; Zhao, Kun ; Wang, Changhai
Author_Institution :
Dept. of Mater., Loughborough Univ., Loughborough, UK
Abstract :
Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) results indicated that a biphasic structure of beta-Sn and Cu6Sn5 was present in the as-electroplated film. Fine pitch near eutectic Sn-Cu solder bumps were also produced on a test wafer.
Keywords :
X-ray diffraction; copper alloys; electrodeposition; eutectic alloys; fine-pitch technology; integrated circuit interconnections; scanning electron microscopy; solders; tin alloys; wafer level packaging; SEM; Sn-Cu; Triton X-100; X-ray diffraction; XRD; biphasic structure; electrodeposition; electronics interconnection; eutectic composition; fine pitch near eutectic solder bumps; iso-octyl phenoxy polyethoxy ethanol; lead-free solder; methanesulphonic acid based baths; scanning electron microscopy; solder alloy; surfactant; Environmentally friendly manufacturing techniques; Ethanol; Lead; Microstructure; Morphology; Scanning electron microscopy; Testing; Tin; X-ray diffraction; X-ray scattering;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270643
