Title :
Gluing as an alternative to solder flexible batteries for its use in system-in-a-package: Preliminary results
Author :
Aguilera, N. B Palacios ; Mollinger, J.R. ; Bastemeijer, J. ; Zhou, J. ; French, P.J. ; Bossche, A.
Author_Institution :
Electron. Instrum. Lab., Tech. Univ. Delft, Delft, Netherlands
Abstract :
Size and cost are two basic issues regarding the mass production of electronics. Flexible batteries have been in development and research in the last few years resulting in an optimal option to reduce the size of the package in a system due to its flexibility; nevertheless, the composition of the battery brings with it a temperature limitation in the process given by the electrolyte which starts to decompose at 80°C. Moreover, the two leads that contact the battery to the outside world are made one of nickel and the other one of aluminum. For these reasons, the use of an electrically conductive adhesive as an alternative to solder and ultrasonic welding is studied.
Keywords :
electronics industry; electronics packaging; mass production; secondary cells; welding; electrically conductive adhesive; electronics mass production; flexible batteries; gluing; system-in-a-package; temperature 80 C; ultrasonic welding; Aluminum; Batteries; Conductive adhesives; Contacts; Costs; Electronics packaging; Lead; Mass production; Nickel; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416486