• DocumentCode
    3520382
  • Title

    A lightweight solution for Wireless LAN: Letter-envelop protocol

  • Author

    Nguyen, Thuc N. ; Tran, Bao N. ; Nguyen, Duc H M

  • Author_Institution
    Fac. of Inf. Technol., Univ. of Natural Sci., Ho Chi Minh City
  • fYear
    2008
  • fDate
    25-27 Aug. 2008
  • Firstpage
    17
  • Lastpage
    21
  • Abstract
    Wireless local area networks (WLAN) are increasingly deployed because of the freedom wireless communications afford and the decreasing costs of the underlying technology. Together with its higher and higher popularity, the Internet has also shown more and more weakness of wireless protocols that lead to attacks. There are a lot of efforts to improve the security of wireless network (from IEEE 802.11 standard protocol to 802.11i builds on top of the IEEE 802.1X standard). But these cannot defend network from denial of service (DoS) attacks. In this paper we focus on analyzing denial of service attacks on 802.11-based protocols, especially de-authentication and disassociation attacks that are called ldquodisrdquosing attacks and propose a solution for defending against ldquodisrdquosingrdquo attack using letter-envelop protocol to authenticate management frames.
  • Keywords
    protocols; telecommunication security; wireless LAN; Internet; denial-of-service attacks; dis-sing attacks; letter-envelop protocol; wireless LAN; wireless local area networks; wireless network security; wireless protocols; Authentication; Cities and towns; Communication system security; Computer crime; Costs; Information technology; Local area networks; Radio spectrum management; Wireless LAN; Wireless application protocol; De-authentication; Disassociation Attack; DoS Attack; Letter-Envelope Protocol; Wireless LAN Security;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Networking in China, 2008. ChinaCom 2008. Third International Conference on
  • Conference_Location
    Hangzhou
  • Print_ISBN
    978-1-4244-2373-6
  • Electronic_ISBN
    978-1-4244-2374-3
  • Type

    conf

  • DOI
    10.1109/CHINACOM.2008.4684959
  • Filename
    4684959