Rapid thermal processing activity in teaching and research in the State University of New York at New Paltz

Author

Eftekhari, G.

Author_Institution

Dept. of Electr. Eng., State Univ. of New York, New Paltz, NY, USA

fYear

1997

fDate

20-23 Jul 1997

Firstpage

43

Lastpage

48

Abstract

The applications of rapid thermal processing in Teaching and Research at the State University of New York at New Paltz are explained. It is used by students in the microelectronic laboratory for oxidation, making ohmic contacts and annealing. In research it is used for oxidation, oxynitridation, study of thermal stability of metal-semiconductor contacts, metal-insulator-semiconductor tunnel diodes, and metal-oxide-semiconductor structures

Keywords

electronic engineering education; ohmic contacts; oxidation; rapid thermal processing; teaching; thermal stability; State University of New York; annealing; metal-insulator-semiconductor tunnel diodes; metal-oxide-semiconductor structures; metal-semiconductor contacts; microelectronic laboratory; ohmic contacts; oxidation; oxynitridation; rapid thermal processing activity; teaching; thermal stability; Diodes; Education; Laboratories; Metal-insulator structures; Microelectronics; Ohmic contacts; Oxidation; Rapid thermal annealing; Rapid thermal processing; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

University/Government/Industry Microelectronics Symposium, 1997., Proceedings of the Twelfth Biennial

Conference_Location

Rochester, NY

ISSN

0749-6877

Print_ISBN

0-7803-3790-5

Type

conf

DOI

10.1109/UGIM.1997.616679

Filename

616679