The warpage control method in epoxy molding compound

This paper is to study the warpage impact of filler content and special additives on BGA packages. The special additives have significant impact on the warpage. The additive A has great influence on the warpage at different temperature; the warpage will flatten when more additive A is added. From the warpage study of single unit from room temperature to 260degC, all the warpage is in 50um when additive A is about 1%. The additive A can flatten the warpage of the package and keep the warpage at same level even with different silicon occupation in the package. The filler content shows great impact on the warpage by control the shrinkage after cured, the lower shrinkage; the package will move to more crying.