DocumentCode
3520484
Title
EMI reducing solution by modify EBG structure for stacked packaging
Author
Chang, Feng-Cheng ; Cheng, Kuan-Wen ; Wu, Sung-Mao
Author_Institution
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
fYear
2009
fDate
9-11 Dec. 2009
Firstpage
524
Lastpage
527
Abstract
In this paper, we investigated the electromagnetic bandgap structure (EBG) is embedded in a multi-layer board to mitigate EMI in an adjacent board. The design of the new EBG structure proposed here relies on the modification of thin lines and patches. The thin lines serve to provide the equivalent inductances. Simulation results can suppress any frequency band noise effectively.
Keywords
electromagnetic interference; electronics packaging; printed circuit design; EBG structure; EMI reducing solution; electromagnetic bandgap structure; embedded system; equivalent inductances; frequency band noise; multilayer board; patches; stacked packaging; thin lines; Coils; Electromagnetic interference; Frequency; Integrated circuit interconnections; Magnetic circuits; Magnetic fields; Metamaterials; Periodic structures; Semiconductor device noise; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location
Singapore
Print_ISBN
978-1-4244-5099-2
Electronic_ISBN
978-1-4244-5100-5
Type
conf
DOI
10.1109/EPTC.2009.5416493
Filename
5416493
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