Title :
EMI reducing solution by modify EBG structure for stacked packaging
Author :
Chang, Feng-Cheng ; Cheng, Kuan-Wen ; Wu, Sung-Mao
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
Abstract :
In this paper, we investigated the electromagnetic bandgap structure (EBG) is embedded in a multi-layer board to mitigate EMI in an adjacent board. The design of the new EBG structure proposed here relies on the modification of thin lines and patches. The thin lines serve to provide the equivalent inductances. Simulation results can suppress any frequency band noise effectively.
Keywords :
electromagnetic interference; electronics packaging; printed circuit design; EBG structure; EMI reducing solution; electromagnetic bandgap structure; embedded system; equivalent inductances; frequency band noise; multilayer board; patches; stacked packaging; thin lines; Coils; Electromagnetic interference; Frequency; Integrated circuit interconnections; Magnetic circuits; Magnetic fields; Metamaterials; Periodic structures; Semiconductor device noise; Semiconductor device packaging;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416493
