Title :
Creep characterization of lead free 80Au-20Sn solder
Author :
Su, Fei ; Pan, Haiyan
Author_Institution :
Inst. of Solid Mech., Beijing Univ. of Aeronaut. & Astronaut., Beijing, China
Abstract :
In this paper, steady-state creep behavior of lead free 80Au-20Sn solder was investigated at three different temperatures (i.e. 25degC, 75degC and 125degC) and a range of stress levels. Hyperbolic-Sine model was employed to characterize the creep properties of the lead free solder, constants in the model were determined through data fitting and were compared with that of other lead free solders.
Keywords :
creep; gold alloys; hyperbolic equations; solders; stress analysis; tin alloys; AuSn; data fitting; hyperbolic-sine model; lead free solder alloys creep characterization; steady-state creep behavior; stress level range; temperature 125 C; temperature 25 C; temperature 75 C; Capacitive sensors; Creep; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Fatigue; Lead; Mechanical factors; Optical materials; Soldering; Testing;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270656
