Cure kinetics analysis and simulation of silicone adhesives

Author

Zhang, Qin ; Song, Bin ; Wang, Simin ; Xu, Ling ; Liu, Sheng

Author_Institution

Sch. of Mech. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

691

Lastpage

694

Abstract

A nonlinear transient heat transfer finite element model based on commercial finite element software, ABAQUS, is developed to simulate the curing process of silicone adhesive. The curing reaction process and specific heat of the silicone adhesive were investigated using a differential scanning calorimetry (DSC) to obtain material parameters for numerical simulations. Curing reaction kinetics was derived. Using the user subroutine HETVAL of ABAQUS, temperature distributions inside silicone can be evaluated by solving the heat conduction equations including internal heat generation produced by curing reactions. Good agreement between experimental data and numerical analysis by ABAQUS is obtained.

Keywords

adhesives; curing; differential scanning calorimetry; finite element analysis; heat conduction; kinetic theory; reaction kinetics; silicones; specific heat; temperature distribution; ABAQUS; cure kinetics analysis; curing reaction process; differential scanning calorimetry; finite element model; finite element software; heat conduction equations; heat transfer; internal heat generation; nonlinear transient; silicone adhesives; specific heat; temperature distributions; user subroutine HETVAL; Algorithms; Analytical models; Calorimetry; Conducting materials; Curing; Finite element methods; Heat transfer; Kinetic theory; Numerical simulation; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270659

Filename

5270659