Title :
2N Au wire bonding for ultra fine picth BGA
Author :
Leng, Eu Poh ; Yong, C.C. ; Siong, Chin Teck ; Masahiro, Tsuriya ; Vo, Nick ; Seong, Lee Boon ; Faizal, Zul-Kifli Mohd ; Sazilawati, Fadzli
Author_Institution :
Freescale Semicond. (M) Sdn. Bhd., Petaling Jaya, Malaysia
Abstract :
In summary, 2N wire is able to improve thermal aging performance of ultra fine pitch wire bonding to meet reliability requirement as stringent as for automotive application. However, to improve mass production friendliness, careful characterization and process optimization need to be done on several areas, namely bonding surface condition, wire bonding process, as well as wire manufacturing process.
Keywords :
ageing; ball grid arrays; fine-pitch technology; lead bonding; 2N wire bonding; Au; automotive application; bonding surface condition; process optimization; stringent; thermal aging; ultra fine picth BGA; wire bonding process; wire manufacturing process; Aging; Bonding; Fingers; Gold; Manufacturing processes; Mass production; Rough surfaces; Substrates; Surface roughness; Wire; 2N Au wire; BGA packaging; dopant; ultra fine pitch wire bond;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416499
