Defect in optoelectronic packaging due to phosphorus content of the underlayer coating

Author

Hsieh, Kenny Cheng-Hsiang ; Tu, Y.K. ; Wang, Stanley C. ; Chang, H.L. ; Wang, Chingyue ; Wang, C.M. ; Liaw, J.W. ; Wang, G.I. ; Chen, C.H. ; Cheng, W.H.

Author_Institution

Inst. of Mater. Sci. & Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

fYear

1998

fDate

3-8 May 1998

Firstpage

150

Lastpage

151

Abstract

Summary form only given. This study has led to an important finding that one of the primary causes for cracks in the laser-welded Au-coated optoelectronic materials is due to the existence of the plating layer during the final stage of solidification. Therefore, it is strongly recommended that a Ni underlayer coating without P content should be used prior to the Au plating to prevent crack formation in laser-welded Au coated optoelectronic packaging.

Keywords

gold; laser beam welding; metallic thin films; optical fabrication; optical films; optoelectronic devices; packaging; Au; Au plating; Ni; Ni underlayer coating; crack formation; laser-welded Au coated optoelectronic packaging; laser-welded Au-coated optoelectronic materials; optoelectronic packaging; phosphorus content; plating layer; solidification; underlayer coating; Coatings; Gold; Laser ablation; Optical materials; Optical pulses; Packaging; Pulsed laser deposition; Pump lasers; Space vector pulse width modulation; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on

Conference_Location

San Francisco, CA, USA

Print_ISBN

1-55752-339-0

Type

conf

DOI

10.1109/CLEO.1998.675983

Filename

675983