DocumentCode :
3520673
Title :
Real time statistical process control for plasma etching
Author :
Guo, Hai-Fang ; Spanos, Costas J. ; Miller, Alan J.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
1991
fDate :
20-22 May 1991
Firstpage :
113
Lastpage :
118
Abstract :
The development and the application of a real-time statistical process control (SPC) scheme are presented. Based on time-series and multivariate statistics, this scheme can accommodate real-time sensor readings such as can be collected from a single-wafer plasma etcher via the SECSII communications protocol. The scheme has been successfully applied on a Lam Rainbow plasma etcher, and it has been able to detect internal machine shifts that cannot be seen with classical SPC procedures
Keywords :
integrated circuit manufacture; process computer control; real-time systems; sputter etching; statistical process control; Lam Rainbow plasma etcher; SECSII communications protocol; SPC; internal machine shifts; multivariate statistics; plasma etching; real-time sensor readings; real-time statistical process control; single-wafer plasma etcher; time series filters; Condition monitoring; Control charts; Degradation; Etching; Manufacturing processes; Plasma applications; Process control; Protocols; Semiconductor device manufacture; Statistics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Science Symposium, 1991. ISMSS 1991., IEEE/SEMI International
Conference_Location :
Burlingame, CA
Print_ISBN :
0-7803-0027-0
Type :
conf
DOI :
10.1109/ISMSS.1991.146278
Filename :
146278
Link To Document :
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