Title :
Inspection of through silicon vias (TSV) and other interconnections in IC packages by computed tomography
Author :
Roth, Holger ; He, Zhenhui ; Mayer, Thomas
Author_Institution :
Gen. Electr. Sensing & Inspection Technol. GmbH, Stuttgart, Germany
Abstract :
Through silicon vias (TSV) as used in 3D integrated electronic packages were inspected non-destructively by highly resolving nanofocus computed tomography (nanoCT). In particular, in the TSVs plating voids were visualised and quantitatively evaluated by numerical processing of the resulting volumetric data. The nanoCT technology is outlined and further applications such as interposers etc. are considered.
Keywords :
integrated circuit packaging; nanotechnology; three-dimensional integrated circuits; tomography; 3D integrated electronic package; IC package; TSV plating void; nanoCT technology; nanofocus computed tomography; through silicon vias; Bonding; Computed tomography; Detectors; Electronics packaging; Inspection; Integrated circuit packaging; Laboratories; Silicon; Through-silicon vias; X-ray imaging;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416506
