Title :
Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder
Author :
Lee, Hwa-Teng ; Chen, Yin-Fa ; Hong, Ting-Fu ; Shih, Ku-Ta
Author_Institution :
Dept. of Mech. Eng., Cheng Kung Univ., Tainan, Taiwan
Abstract :
The relation between cooling rate and morphology of Ag3Sn IMCs was investigated in this study. The morphology of Ag3Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag3Sn depended on cooling rate, the morphology and size of Ag3Sn compounds were affected by cooling rate. The three types of Ag3Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag3Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.
Keywords :
eutectic alloys; nucleation; silver alloys; solders; solidification; tin alloys; AgSn; cooling rate; eutectic alloys; intermetallic compounds; nucleation time; solidification; Aluminum; Cooling; Intermetallic; Materials science and technology; Mechanical engineering; Microstructure; Morphology; Temperature; Testing; Tin;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270669
