DocumentCode
3520793
Title
First-principles study of Si CMOS materials and nanostructures
Author
Chang, Kee Joo ; Noh, Hyeon-Kyun ; Choi, Eun-Ae ; Ryu, Byungki
Author_Institution
Dept. of Phys., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fYear
2011
fDate
8-10 Sept. 2011
Firstpage
9
Lastpage
9
Abstract
Summary form only given. The technology roadmap reflects that complementary metal-oxide-semiconductor field-effect transistors based on silicon will reach absolute limits on its performance within the next decade. In microelectronics, quantum effects become important and the device performance is very sensitive to defects at or close to interfaces. To improve the device operation, it is urgent to understand materials, defects, and interface properties at the atomic level. First-principles calculations, based on the density functional theory, enable us to investigate important aspects of the physics of materials and structures. We will discuss successful applications and limitations of the modern computational techniques, such as the standard generalized gradient approximation, hybrid density functional, and quasiparticle energy calculations, for the electronic and transport properties and the role of defects in Si CMOS devices with Si/high-k and metal/high-k interfaces.
Keywords
CMOS integrated circuits; MOSFET; ab initio calculations; density functional theory; elemental semiconductors; gradient methods; nanostructured materials; quasiparticles; silicon; Si CMOS material; atomic level; complementary metal-oxide-semiconductor field-effect transistor; computational technique; density functional theory; first-principles study; gradient approximation; high-k interface; interface properties; microelectronics; nanostructure; quantum effect; quasiparticle energy calculation; technology roadmap; transport properties; CMOS integrated circuits; CMOS technology; High K dielectric materials; Performance evaluation; Physics; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
Conference_Location
Osaka
ISSN
1946-1569
Print_ISBN
978-1-61284-419-0
Type
conf
DOI
10.1109/SISPAD.2011.6035035
Filename
6035035
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