• DocumentCode
    3520793
  • Title

    First-principles study of Si CMOS materials and nanostructures

  • Author

    Chang, Kee Joo ; Noh, Hyeon-Kyun ; Choi, Eun-Ae ; Ryu, Byungki

  • Author_Institution
    Dept. of Phys., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2011
  • fDate
    8-10 Sept. 2011
  • Firstpage
    9
  • Lastpage
    9
  • Abstract
    Summary form only given. The technology roadmap reflects that complementary metal-oxide-semiconductor field-effect transistors based on silicon will reach absolute limits on its performance within the next decade. In microelectronics, quantum effects become important and the device performance is very sensitive to defects at or close to interfaces. To improve the device operation, it is urgent to understand materials, defects, and interface properties at the atomic level. First-principles calculations, based on the density functional theory, enable us to investigate important aspects of the physics of materials and structures. We will discuss successful applications and limitations of the modern computational techniques, such as the standard generalized gradient approximation, hybrid density functional, and quasiparticle energy calculations, for the electronic and transport properties and the role of defects in Si CMOS devices with Si/high-k and metal/high-k interfaces.
  • Keywords
    CMOS integrated circuits; MOSFET; ab initio calculations; density functional theory; elemental semiconductors; gradient methods; nanostructured materials; quasiparticles; silicon; Si CMOS material; atomic level; complementary metal-oxide-semiconductor field-effect transistor; computational technique; density functional theory; first-principles study; gradient approximation; high-k interface; interface properties; microelectronics; nanostructure; quantum effect; quasiparticle energy calculation; technology roadmap; transport properties; CMOS integrated circuits; CMOS technology; High K dielectric materials; Performance evaluation; Physics; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
  • Conference_Location
    Osaka
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-61284-419-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.2011.6035035
  • Filename
    6035035