DocumentCode
3520843
Title
iNEMI HFR-free program report
Author
Fu, Haley ; Tisdale, Stephen ; Rausch, Martin ; Davignon, John ; Hall, Stephen H. ; Pfahl, Robert C.
Author_Institution
iNEMI, China
fYear
2009
fDate
10-13 Aug. 2009
Firstpage
627
Lastpage
632
Abstract
The electronics industry is aggressively pursuing the removal of potentially toxic compounds from their products, including the halogenated flame retardants (HFRs) that were once widely used in electronics housings and cases and are still used extensively in printed circuit boards. Several leading electronics companies have publicly stated their intent to remove brominated and/or halogenated flame retardants from some or all of their products. The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, is working with a number of its OEM and supply chain members to assess the feasibility of a broad conversion to HFR-free PCB materials. While IPC and JEDEC are developing halogen-free standard specifications and numerous companies have compliant materials, significant questions remain regarding overall readiness to make a transition to these materials. This paper will discuss results & conclusions from the completed iNEMI HFR-free PCB materials project, as well as outline current projects, which include the HFR-free high-reliability PCB project, the HFR-free signal integrity project and the HFR-free PCB material development project.
Keywords
electronics industry; flame retardants; printed circuit manufacture; reliability; supply chains; HFR-free PCB material development project; HFR-free PCB materials; HFR-free signal integrity project; IPC; JEDEC; electronics housings; electronics industry; halogen-free standard specifications; halogenated flame retardants; high-reliability PCB project; iNEMI; international electronics manufacturing initiative; printed circuit boards; supply chain; Additives; Electronics industry; Flame retardants; IEC standards; Industrial electronics; Laminates; Plastics; Polymers; Resins; Supply chains;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4658-2
Electronic_ISBN
978-1-4244-4659-9
Type
conf
DOI
10.1109/ICEPT.2009.5270674
Filename
5270674
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