• DocumentCode
    3520843
  • Title

    iNEMI HFR-free program report

  • Author

    Fu, Haley ; Tisdale, Stephen ; Rausch, Martin ; Davignon, John ; Hall, Stephen H. ; Pfahl, Robert C.

  • Author_Institution
    iNEMI, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    627
  • Lastpage
    632
  • Abstract
    The electronics industry is aggressively pursuing the removal of potentially toxic compounds from their products, including the halogenated flame retardants (HFRs) that were once widely used in electronics housings and cases and are still used extensively in printed circuit boards. Several leading electronics companies have publicly stated their intent to remove brominated and/or halogenated flame retardants from some or all of their products. The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, is working with a number of its OEM and supply chain members to assess the feasibility of a broad conversion to HFR-free PCB materials. While IPC and JEDEC are developing halogen-free standard specifications and numerous companies have compliant materials, significant questions remain regarding overall readiness to make a transition to these materials. This paper will discuss results & conclusions from the completed iNEMI HFR-free PCB materials project, as well as outline current projects, which include the HFR-free high-reliability PCB project, the HFR-free signal integrity project and the HFR-free PCB material development project.
  • Keywords
    electronics industry; flame retardants; printed circuit manufacture; reliability; supply chains; HFR-free PCB material development project; HFR-free PCB materials; HFR-free signal integrity project; IPC; JEDEC; electronics housings; electronics industry; halogen-free standard specifications; halogenated flame retardants; high-reliability PCB project; iNEMI; international electronics manufacturing initiative; printed circuit boards; supply chain; Additives; Electronics industry; Flame retardants; IEC standards; Industrial electronics; Laminates; Plastics; Polymers; Resins; Supply chains;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270674
  • Filename
    5270674