Title :
Research on strength descent of wire bonding in the packing
Author :
Dezheng, Zhang ; Shengxiang, Bao ; Lili, Ma ; Dechun, Lv
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
For microelectronics packaging, it connects the substrates with pin wire in the way of wire bonding for separate electronic components packing, and also called wire bonding technology. For a long time, rockii effect is thought as the normal invalid forms. But now the more and more study shows Kiekendall voids are the main factors that influence the bonding intensity. Aiming at the model SOT23 transistor, we analysis the form of Kiekendall voids of wire bonding.
Keywords :
integrated circuit packaging; lead bonding; substrates; transistors; Kickendall voids; SOT23 transistor; electronic components packing; microelectronics packaging; pin wire; rockii effect; substrates; wire bonding; Bonding; Electronic components; Electronics packaging; Gold; Intermetallic; Microelectronics; Probes; Substrates; Testing; Wire;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416519
