• DocumentCode
    3520988
  • Title

    Strong anisotropy and diameter effects on the low-field mobility of silicon nanowires

  • Author

    Neophytou, Neophytos ; Kosina, Hans

  • Author_Institution
    Inst. for Microelectron., Techinical Univ. of Vienna, Vienna, Austria
  • fYear
    2011
  • fDate
    8-10 Sept. 2011
  • Firstpage
    31
  • Lastpage
    34
  • Abstract
    We describe a method to couple the sp3d5s*-spin-orbit-coupled (SO) atomistic tight-binding (TB) model and linearized Boltzmann transport theory for the calculation of low-field mobility in Si nanowires (NWs). We consider scattering mechanisms due to phonons and surface roughness. We perform a simulation study of the low-field mobility in n-type and p-type Si NWs of diameters from 3nm to 12nm, in the [100], [110] and [111] transport orientations. We find that the NW mobility is a strong function of orientation and diameter. This is a consequence of the large variations in the electronic structure with geometry and quantization. Especially in the case of p-type [111] and [110] NWs, large phonon-limited mobility improvements with diameter scaling are observed.
  • Keywords
    Boltzmann equation; band structure; carrier mobility; elemental semiconductors; nanowires; phonons; silicon; spin-orbit interactions; surface scattering; tight-binding calculations; Si; [100] transport orientation; [110] transport orientation; [111] transport orientation; band structure; electronic structure; linearized Boltzmann transport theory; low-field mobility simulation; n-type silicon nanowire; p-type silicon nanowire; phonon-limited mobility; phonons; scattering mechanisms; silicon nanowires; size 3 nm to 12 nm; spin-orbit-coupled atomistic tight-binding model; surface roughness; Anisotropic magnetoresistance; Computational modeling; Effective mass; Nanowires; Phonons; Scattering; Silicon; Boltzmann transport; MOSFETs; Si nanowires; atomistic; bandstructure; low-field mobility; sp3d5s* tight binding model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
  • Conference_Location
    Osaka
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-61284-419-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.2011.6035042
  • Filename
    6035042