Title :
Micro-structural and interfacial effects on the dielectric properties of High-k aluminum/epoxy composites for embedded capacitors
Author :
Chen, Chong ; Yu, Shuhui ; Sun, Rong ; Luo, Suibin ; Weng, Lvqian ; Du, Ruxu
Author_Institution :
Shenzhen Inst. of Adv. Technol., Shenzhen, China
Abstract :
Electrically percolative composites have attracted much attention because they exhibit a high dielectric constant at a critical concentration of the conductive fillers. Aluminum (Al) is well known as a fast self-passivation and low-density metal. The thin and dense passivation layer forms an insulating boundary layer outside the metallic spheres (core-shell) which lowers the dielectric loss and realizes high filler loading levels. In this article, the influences of the content of Al, the size of Al core, the thickness of Al2O3 shell, and the two interfaces of polymer-Al2O3 and Al2O3-Al on the dielectric behaviors of the resulting percolative composites have been systematically analyzed and interpreted. For the composite containing 70 vol.% of 1.0 mum aluminum, a dielectric constant of 95.49 and a low dielectric loss of about 0.05 over a frequency range of 100 Hz~10 MHz was achieved. The broad peak over a wide volume fraction range of the percolation threshold concentration makes the material reproducible for use.
Keywords :
composite materials; dielectric losses; high-k dielectric thin films; conductive fillers; dielectric loss; dielectric properties; electrically percolative composites; embedded capacitors; high-k aluminum/epoxy composites; insulating boundary layer; interfacial effects; micro-structural; Aluminum; Capacitors; Dielectric constant; Dielectric losses; Dielectrics and electrical insulation; Frequency; High K dielectric materials; High-K gate dielectrics; Passivation; Polymers;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270682