• DocumentCode
    3521002
  • Title

    Simulation of channel electron mobility due to scattering with interfacial phonon-plasmon modes in silicon nanowire under the presence of high-k oxide and metal gate

  • Author

    Xiu, Kai

  • Author_Institution
    Semicond. R&D Center, IBM, Hopewell Junction, NY, USA
  • fYear
    2011
  • fDate
    8-10 Sept. 2011
  • Firstpage
    35
  • Lastpage
    38
  • Abstract
    The channel electron mobility of a 1D nanowire due to scattering with interfacial phonon-plasmon modes arising from the high-k dielectric material under the presence of polysilicon or metal gate is studied in this manuscript. We solved the dispersion relationship of the coupled modes and the accompanying effective scattering potential for carrier relaxation in the channel. The resulting mobility was calculated for a series of geometrical configurations with polysilicon/metal as the gate material. We found that for the polysilicon gate case the mechanism gives rise to a significantly low mobility in the low to mid electrical field range, and that wires with smaller diameter suffer more heavily. Our simulation also reveals that metal gate effectively mitigates the effect through the suppression of effective scattering field.
  • Keywords
    carrier relaxation time; electron mobility; elemental semiconductors; nanowires; phonon-plasmon interactions; semiconductor-metal boundaries; silicon; silicon compounds; 1D nanowire; Si-SiO2; carrier relaxation; channel electron mobility; geometrical configuration; high-k dielectric material; high-k oxide; interfacial phonon-plasmon mode; metal gate; scattering potential; Dielectrics; Logic gates; Metals; Phonons; Plasmons; Scattering; Silicon; HKMG; dielectrics; dynamic screening; high-k; metal gate; mobility; plasmon; silicon; silicon nanowire; soft phonon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
  • Conference_Location
    Osaka
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-61284-419-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.2011.6035043
  • Filename
    6035043