Title :
Growth kinetics and microstructural evolution of Cu-Sn intermetallic compounds on different Cu substrates during thermal aging
Author :
Liu, Z.Q. ; Shang, P.J. ; Li, D.X. ; Shang, J.K.
Author_Institution :
Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang, China
Abstract :
The microstructure of the eutectic SnBi/Cu interface was investigated by transmission electron microscopy (TEM). In-situ and ex-situ thermal aging were conducted to study the nucleation and growth of Cu3Sn and Cu6Sn5 on both polycrystalline and single crystalline Cu substrates. The growth kinetic analysis showed that although the growth of total IMCs (Cu3Sn + Cu6Sn5) was similar on single and polycrystalline Cu substrates, the Cu3Sn grew faster on polycrystalline Cu substrate than that on single crystal Cu substrate, while Cu6Sn5 grew slowly on polycrystalline Cu during thermal aging.
Keywords :
ageing; copper alloys; eutectic alloys; nucleation; tin alloys; transmission electron microscopy; Cu-Sn; eutectic interface; growth kinetics; intermetallic compounds; microstructural evolution; polycrystalline substrates; single crystalline substrates; thermal aging; transmission electron microscopy; Aging; Copper; Crystal microstructure; Crystallization; Intermetallic; Kinetic theory; Scanning electron microscopy; Solid state circuits; Thickness measurement; Transmission electron microscopy;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270685
