Title :
Assessment of LF solder joint reliability by four point cyclic bending
Author :
Wang, Jifan ; Ye, Yuming ; Zhao, Junying ; Liu, Sang ; Tu, Yunhua ; Li, Song ; Song, Zhiwei
Author_Institution :
Huawei Technol. Co., Ltd., Shenzhen, China
Abstract :
Quick and effective reliability assessment method is one of aspired targets for product development and test. Base on specific design board, this paper study the effect of four-point cyclic bend test parameters, such as deflection and temperature to lead-free solder joint fatigue life and failure mode, compare the performance of lead-free joints in four-point cyclic bend and accelerated temperature cycling(ATC), explore the application of four-point cyclic bend test method in lead-free solder joint reliability assessment.
Keywords :
bending; product development; reliability; solders; LF solder joint reliability; accelerated temperature cycling; four-point cyclic bend test parameters; lead-free solder joint reliability assessment; product development; reliability assessment method; Assembly; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Life estimation; Life testing; Soldering; Temperature; US Department of Energy;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270686
