Title :
Preparation and properties of epoxy resin/silicone hybrids for electronic applications
Author :
Lee, Seon Suk ; Song, G.S. ; Lee, D.W. ; Kim, H.N. ; Kang, K.H. ; Lee, Dai Soo
Author_Institution :
Div. of Semicond. & Chem. Eng., Chonbuk Nat. Univ., Jeonju, South Korea
Abstract :
Epoxy resin/silicone hybrids were synthesized through the cationic polymerization of a cycloaliphatic epoxy resin and a hydroxy-terminated poly(dimethyl siloxane) (PDMS) in different molar ratios. Molar ratios of the epoxy resin and silicone for the hybrids were 1/1, 1/0.75, 1/0.5, 1/0.25.3-Glycidoxypropyl-trimethoxysilane (GPTMS) was also added to the epoxy resin/silicone mixtures to improve the transparency by the reaction between GPTMS and the resin mixtures. The hybrids of epoxy resin/silicone became transparent with increasing the content of PDMS. The addition of GPTMS resulted in the large increase of transparency of the hybrids even at lower concentration of PDMS. Some opaque hybrid samples showed two glass transition temperatures in the thermograms obtained with differential scanning calorimetery (DSC). In case of the hybrids containing GPTMS, nanoparticles of silica were observed in transmission electron microscopy (TEM) images even though they appeared highly transparent after cure.
Keywords :
resins; silicones; cationic polymerization; cycloaliphatic epoxy resin; differential scanning calorimetery; glass transition temperatures; molar ratios; nanoparticles; resin mixtures; silica; silicone hybrids; silicone mixtures; thermograms; transmission electron microscopy image; Aluminum; Curing; Electrons; Epoxy resins; Light emitting diodes; Moisture; Polymers; Temperature; Thermal resistance; Thermal stability;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416525
