Title :
Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth
Author :
Han, Y.D. ; Jing, H.Y. ; Nai, S.M.L. ; Xu, L.Y. ; Tan, C.M. ; Wei, J.
Author_Institution :
Sch. of Mater. Sci. & Eng., Tianjin Univ., Tianjin, China
Abstract :
In the present study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix, to form a composite solder. The interfacial intermetallic compound layer thickness formed on electroless nickel immersion gold (ENIG) metallized Cu substrate was determined under the as-soldered condition. It was observed that the addition of 0.01 wt.% Ni-CNTs into the Sn-Ag-Cu solder matrix, affected the formation of intermetallic compounds during the soldering reaction. For the reaction between the composite solder and the ENIG/Cu substrate, (Cu1-xNix)6Sn5 and (Cu1-yNiy)3Sn4 were formed. The test results revealed that the thickness of interfacial IMC decreased from 2.30 ¿m to 1.84 ¿m with the addition of Ni-CNTs. Shear tests were also conducted on the as-soldered solder joints. The shear test results revealed that the composite solder joint exhibited a ~15% increase in yield strength and a ~17% increase in ultimate shear strength, as compared to its monolithic counterpart.
Keywords :
carbon nanotubes; copper alloys; electroless deposited coatings; integrated circuit metallisation; nickel alloys; silver alloys; solders; tin alloys; Ni; Sn-Ag-Cu; carbon nanotube; composite solder; electroless nickel immersion gold metallized substrate; interfacial IMC; interfacial intermetallic compound layer thickness; interfacial intermetallic layer growth; shear test; soldering reaction; Carbon nanotubes; Gold; Image analysis; Intermetallic; Metallization; Nickel; Scanning electron microscopy; Soldering; Temperature; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416534
