Title :
Fracture behavior of 96.5Sn3.0Ag0.5Cu solder joint under mixed-mode tensile and shear loading conditions
Author :
Tan, Kok Ee ; Pang, John H L
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
Solder joints are subjected to a complex combined loading condition of tensile and shear deformation. The fracture behavior of solder joints is different when it is subjected to pure-tensile, pure shear or varying combination of mixed-mode tension and shear loading combinations. The observed failure modes can vary from brittle intermetallic (IMC) layer failure to ductile bulk solder shear failure. Under mixed-mode loading, a complex combination of IMC and solder failure mechanism is observed. In this study, the fracture behavior of solder joint will be investigated to study effect of mode mixity and plastic constraint on the failure mechanism. The fracture failure mode and behavior were observed and discussed under a range of fracture load cases.
Keywords :
brittle fracture; copper alloys; shear deformation; silver alloys; soldering; tensile testing; tin alloys; SnAgCu; brittle intermetallic layer failure; ductile bulk solder; fracture behavior; fracture failure; fracture load; mixed-mode loading; mixed-mode tensile; mode mixity; plastic constraint; shear deformation; shear failure; shear loading; solder failure; solder joint; tensile deformation; Bonding; Capacitive sensors; Coordinate measuring machines; Copper; Failure analysis; Intermetallic; Soldering; Temperature; Tensile strain; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416535
